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3.0 W/mK Thermally Conductive Silicone Potting Compound for IGBT Power Module BMS PCB Encapsulation UL94 V-0

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3.0 W/mK Thermally Conductive Silicone Potting Compound for IGBT Power Module BMS PCB Encapsulation UL94 V-0

Name: 30 WmK Thermally Conductive Silicone Potting Compound for IGBT Power Module BMS PCB Encapsulation UL94 V0
Brand: HanasT
Price: 1 USD

Buy cheap 3.0 W/mK Thermally Conductive Silicone Potting Compound for IGBT Power Module BMS PCB Encapsulation UL94 V-0 product

Flame Retardant Rating : UL94 V-0

Density : 2.65±0.05 g/cm³

Place of Origin : Guangdong, China

Temperature Range : -40°C to +150°C

Hardness : 45-50 Shore A

Thermal Conductivity : 3.0 W/m·K

Viscosity : 11000±2000 mPa·s

Certification : ROHS

Curing Type : Two-Component Addition Cure (1:1 Mix Ratio)

Dielectric Strength : ≥18 kV/mm

Appearance : Grey Liquid (A+B Components)

Brand Name : HanasT

Packaging Details : 20kg/barrel or 200kg/drum, export-grade packaging with moisture-proof seal and palletized shipping

Curing Time at 25°C : 4-6 hours (tack-free), 24 hours (full cure)

Delivery Time : 3-5 working days for sample, 7-15 days for bulk order

MOQ : 1 Kilogram

Payment Terms : T/T,L/C,PayPal,WU

Supply Ability : 50000 Kilograms per Month

Model Number : HN-8830A/B

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3.0 W/mK Thermally Conductive Silicone Potting Compound for Power Electronics Encapsulation

The HN-8830A/B is a high-performance, two-component addition-cure silicone potting compound engineered for demanding power electronics applications. With an industry-leading 3.0 W/m·K thermal conductivity, it efficiently dissipates heat from IGBT modules, power semiconductors, BMS circuits, and PCB assemblies, ensuring long-term reliability under extreme thermal cycling conditions.

Key Features & Advantages

Superior Thermal Management: 3.0 W/m·K thermal conductivity achieved through high-density aluminum oxide and aluminum nitride filler packing, outperforming standard 1.0-2.0 W/mK potting compounds.
IGBT Power Module Optimized: Specifically formulated for IGBT, MOSFET, and SiC power module encapsulation, preventing thermal runaway in high-power switching applications.
UL94 V-0 Flame Retardancy: Self-extinguishing formulation meets the strictest fire safety requirements for EV battery systems, charging infrastructure, and industrial power supplies.
Excellent Electrical Insulation: Dielectric strength ≥18 kV/mm provides reliable high-voltage isolation for BMS, traction inverters, and DC-DC converters.
Wide Operating Temperature: Maintains stable mechanical and electrical properties from -40°C to +150°C, suitable for under-hood automotive and outdoor industrial environments.
Low Viscosity & Self-Leveling: 11,000±2,000 mPa·s viscosity enables complete penetration into tight PCB gaps and complex IGBT module geometries without air entrapment.
RoHS & REACH Compliant: Fully compliant with EU environmental regulations for global supply chain acceptance.

Target Applications

Application Field	Specific Uses
New Energy Vehicles (EV)	On-Board Charger (OBC), Battery Management System (BMS), DC-DC Converter, Traction Inverter, Motor Controller, PTC Heater Controller
Power Electronics	IGBT Module Encapsulation, Power MOSFET Packaging, SiC/GaN Power Device Potting, High-Voltage Transformer, Power Factor Correction (PFC) Module
Industrial Electronics	Variable Frequency Drive (VFD), Servo Drive, Industrial UPS, Welding Machine Controller, High-Power LED Driver
Energy Storage Systems	Battery Pack Module Sealing, Energy Storage Converter (PCS), Grid-Tie Inverter, Solar Junction Box
5G & Telecom	5G Base Station Power Supply, RRU/AAU Encapsulation, Telecom Rectifier Module

Technical Specifications

Parameter	Value
Appearance (Part A/B)	Grey Liquid / Transparent to Slightly Yellow Liquid
Mix Ratio (A:B by Weight)	1:1
Mixed Viscosity	11,000 ± 2,000 mPa·s @ 25°C
Pot Life @ 25°C	60-90 minutes
Curing Time @ 25°C	4-6 hours (tack-free), 24 hours (full cure)
Hardness	45-50 Shore A
Thermal Conductivity	3.0 W/m·K (ASTM D5470)
Dielectric Strength	≥18 kV/mm
Volume Resistivity	≥1.0 * 10¹⁴ Ω·cm
Flame Retardant Rating	UL94 V-0 (Equivalent)
Temperature Range	-40°C to +150°C
Density (Cured)	2.65 ± 0.05 g/cm³
Linear Shrinkage	<0.1%
Water Absorption (24h)	<0.2%

Why Choose HanasT HN-8830A/B?

As a leading silicone potting compound manufacturer in China, Shenzhen Hanast New Material Co., Ltd. provides full OEM/ODM customization services. Our 40,000-square-meter facility with advanced thermal conductivity testers, laser particle size analyzers, and high-voltage dielectric strength testers ensures consistent batch-to-batch quality. We offer free samples for customer evaluation, custom formulation adjustments for specific viscosity, hardness, or thermal conductivity requirements, and comprehensive MSDS/TDS documentation with every shipment. Contact our engineering team today to discuss your IGBT potting, BMS encapsulation, or PCB potting project requirements.

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